Micron Technology DRAM SDRAM-DDR3L, Part #: MT52L512M32D2PU-107 WT:B TR | Dynamic random access memory | DEX sort-xilfpga Xiilnx FPGA Part #XC7K325T-2FBG900C

Xiilnx FPGA Part #XC7K325T-2FBG900C

3-Ply Face Mask Level 2 with Ear loop

Detailed Description: MSP430 CPUXV2 MSP430™ FRAM Microcontroller IC 16-Bit 16MHz 128KB (128K x 8) FRAM 48-VQFN (7x7)

CPQ:405760-001

Micron Technology DRAM SDRAM-DDR3L, Part #: MT52L512M32D2PU-107 WT:B TR | Dynamic random access memory | DEX sort-xilfpga Xiilnx FPGA Part #XC7K325T-2FBG900CMicron Technology DRAM SDRAMMobile , Part #: MT52L512M32D2PU 107 WT: B TR features: VDD = VDDQ = 1. 5V 0. 075V 1. 5V center terminated push pull I O Differential bidirectional data strobe 8n bit prefetch architecture Differential clock inputs (CK, CK#) 8 internal banks Nominal and dynamic on die termination (ODT) for data, strobe, and mask signals Programmable CAS READ latency (CL) Posted CAS additive latency (AL) Programmable CAS WRITE latency (CWL)